Jig for measuring emc of semiconductor chip and method for measuring emc of semiconductor chip using the same

ABSTRACT

Disclosed are a jig for measuring EMC of a semiconductor chip and a method for measuring EMC that can accurately measure the EMC at a semiconductor chip level. The jig for measuring EMC of a semiconductor chip according to the exemplary embodiment of the present disclosure includes: a chip mount unit on which the semiconductor chip for which the EMC is to be measured is mounted; a memory unit configured to store EMC information of components in a system in which the semiconductor chip is used; and a measurement control unit configured to extract the EMC information stored in the memory unit and provide the extracted EMC information to the chip mount unit at the time of measuring the EMC of the semiconductor chip.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority from Korean PatentApplication No. 10-2012-0008210, filed on Jan. 27, 2012, with the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein in its entirety by reference.

TECHNICAL FIELD

The present disclosure relates to a jig for measuring electro magneticcompatibility (EMC) at a semiconductor chip level and a method formeasuring EMC using the same.

BACKGROUND

EMC means the capability of electronic equipment that can coexist withother equipment under an environment in which electronic equipmentgenerates without mutually causing degradation or loss of function.Today, electronic equipment manufactured in international markets needsto coincide with numerous regulations associated with the EMC andproduct stability presented by governmental organizations, privatestandard groups, self-regulation associations and the like.

EMC measurement in the related art is generally performed at a printedcircuit board level, that is, a system level, and for the EMCmeasurement, a TEM cell (including a GTEM cell) method, a surface scanmethod, a bulk current injection (BCI) method, a direct power injection(DPI) method, a workbench Faraday cage method and the like are used.However, the influence of each of internal semiconductor chips orcomponents cannot be known by the system-level measurement.

A method using a jig on which the semiconductor chips can be mounted maybe considered in order to measure EMC at a semiconductor chip level.However, when a general jig in the related art is used, it is difficultto reflect a real operation situation of the system in the EMCmeasurement, and as a result, it is difficult to accurately measure theEMC with respect to the semiconductor chip.

As one example, a case of measuring EMC of a chip for a micro controllerunit 105 used in a tire pressure monitoring system (TPMS) 100 amongautomobile semiconductor chips will be described through FIG. 1.

As illustrated in FIG. 1, the TPMS 100 further includes a sensor forsensing the pressure of a tire and an analog/digital converter 103 fortransferring a sensed signal to the MCU 105 in addition to the MCU 105.

Among them, when a jig mounted with the MCU 105 is manufactured in orderto measure EMC of the chip for the MCU 105, according to the relatedart, only the MCU 105 is mounted on the jig, and as a result,interactions with other components including the tire pressure sensor101, the A/D converter 103, and the like constituting the TPMS 100 arenot considered. Since the components have different characteristics foreach model of each manufacturing company, EMC characteristics thereofhave no choice but to be different, but the jig is manufactured withoutconsidering the matters.

SUMMARY

The present disclosure has been made in an effort to provide a jig formeasuring EMC of a semiconductor chip and a method for measuring EMCthat can accurately measure the EMC at a semiconductor chip level byproviding means that can allow various operation environments of asystem in which the semiconductor chip is used into a database and storethe database within a jig.

An exemplary embodiment of the present disclosure provides a jig formeasuring EMC of a semiconductor chip, including: a chip mount unit onwhich the semiconductor chip for which the EMC is to be measured ismounted; a memory unit configured to store EMC information of componentsin a system in which the semiconductor chip is used; and a measurementcontrol unit configured to extract the EMC information stored in thememory unit and provide the extracted EMC information to the chip mountunit at the time of measuring the EMC of the semiconductor chip. The jigmay further include: a signal input unit configured to receive aplurality of control signals for driving the jig; and a measurementresult output unit configured to output the measurement result of theEMC for the semiconductor chip.

The chip mount unit may implement various operation environments of thesystem in which the semiconductor chip is used by using the EMCinformation provided from the memory unit at the time of measuring theEMC of the semiconductor chip.

The memory unit may include: a general database configured to storeinformation required for a general function test of the semiconductorchip; an EMC database configured to make EMC information of componentsin the system according to an operation situation of the system into adatabase and store the EMC data; a data selection unit configured toprovide the information stored in the general database or the EMCdatabase to the chip mount unit by the control of the measurementcontrol unit; and a measurement database configured to store ameasurement result of the chip mount unit.

Another exemplary embodiment of the present disclosure provides a methodfor measuring EMC of a semiconductor chip, including: mounting thesemiconductor chip for which the EMC is to be measured on a jig;implementing predetermined operation environments of a system in whichthe semiconductor chip is used through the jig; and measuring the EMC ofthe semiconductor chip under the implemented operation environments.

According to the exemplary embodiments of the present disclosure, theEMC can be measured at the level of each of the semiconductor chipsconstituting the system.

EMC information on the components in the system in which thesemiconductor chip is used is made into the database and stored in thememory of the jig, and the information stored at the time of measuringEMC is used to measure the EMC of the semiconductor chip while variousreal operation environments of the system are reflected.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic configuration diagram of a general TPMS.

FIG. 2 is a configuration diagram of a jig for measuring EMC accordingto an exemplary embodiment of the present disclosure.

FIG. 3 is a configuration diagram illustrating a memory unit 203 of FIG.2 in detail.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawing, which form a part hereof. The illustrativeembodiments described in the detailed description, drawing, and claimsare not meant to be limiting. Other embodiments may be utilized, andother changes may be made, without departing from the spirit or scope ofthe subject matter presented here.

FIG. 2 is a configuration diagram of a jig for measuring EMC accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 2, a jig for measuring EMC according to an exemplaryembodiment of the present disclosure includes a chip mount unit 201 onwhich a semiconductor chip for which the EMC is to be measured ismounted, a memory unit 203 configured to store EMC information ofcomponents in a system in which the semiconductor chip is used, ameasurement control unit 205 configured to extract the EMC informationstored in the memory unit 203 and provide the extracted EMC informationto the chip mount unit 201 at the time of measuring the EMC of thesemiconductor chip, a signal input unit 207 configured to receive aplurality of control signals for driving the jig and a measurementresult output unit 209 configured to output an EMC measurement resultfor the semiconductor chip.

In the present disclosure, EMC information under various operationsituations of the components in the system in which the semiconductorchip for which the EMC is to be measured is used is made into a databaseand is stored in the memory unit 203, and the EMC information stored inthe memory unit 203 is referred at the time of measuring the EMC of thesemiconductor chip so as to reflect an operating environment in anactually implemented system as it is.

The signal input unit 207 receives a plurality of control signalsincluding all signals for driving the jig, that is, a mode signal fordetermining whether the EMC is measured for the semiconductor chip, aclock signal for synchronizing the jig and the semiconductor chip, avoltage signal for driving the memory unit 203 and a reset signal andtransfers the received control signals to the respective components inthe jig. Herein, it may be determined by the mode signal whether the EMCof the semiconductor chip mounted on the jig will be measured or whethera general function test will be performed.

FIG. 3 is a configuration diagram illustrating the memory unit 203 ofFIG. 2 in detail.

Referring to FIG. 3, the memory unit 203 of the jig for measuring EMCaccording to the exemplary embodiment of the present disclosure includesa general database 301, an EMC database 303, a measurement database 305and a data selection unit 307.

Information required for the general function test of the semiconductorchip is stored in the general database 301 and the EMC information ofthe components in the system according to various operation situationsof the system is made into the database and stored in the EMC database303. The data selection unit 307 provides the information stored in thegeneral database 301 or the EMC database 303 to the chip mount unit 201by the control of the measurement control unit 205.

In detail, only the information stored in the general database 301 maybe extracted to be transferred to the chip mount unit 201 through thedata selection unit 307 at the time of performing the general functiontest of the semiconductor chip mounted on the jig, and the informationstored in the general database 301 and the information stored in the EMCdatabase 303 may be together extracted to be transferred to the chipmount unit 201 through the data selection unit 307 at the time ofmeasuring EMC of semiconductor chip.

The measurement database 305 stores a measurement result of the chipmount unit 201. In this case, for more precise measurement, anintermediate result may be stored even when measurement is in progressin the chip mount unit 201. For example, when a measurement rangeintends to be increased by a method of increasing a clock frequencyduring the measurement, previous measurement data may be temporarilystored so as to compare measurement results in different ranges afterthe measurement is completely terminated.

From the foregoing, it will be appreciated that various embodiments ofthe present disclosure have been described herein for purposes ofillustration, and that various modifications may be made withoutdeparting from the scope and spirit of the present disclosure.Accordingly, the various embodiments disclosed herein are not intendedto be limiting, with the true scope and spirit being indicated by thefollowing claims.

What is claimed is:
 1. A jig for measuring EMC at a semiconductor chiplevel, comprising: a chip mount unit on which the semiconductor chip forwhich the EMC is to be measured is mounted, wherein various operationenvironments of a system in which the semiconductor chip is used areimplemented in the chip mount unit at the time of measuring the EMC ofthe semiconductor chip.
 2. A jig for measuring EMC at a semiconductorchip level, comprising: a chip mount unit on which the semiconductorchip for which the EMC is to be measured is mounted; a memory unitconfigured to store EMC information of components in a system in whichthe semiconductor chip is used; and a measurement control unitconfigured to extract the EMC information stored in the memory unit andprovide the extracted EMC information to the chip mount unit at the timeof measuring the EMC of the semiconductor chip.
 3. The jig of claim 2,wherein the chip mount unit implements various operation environments ofthe system in which the semiconductor chip is used by using the EMCinformation provided from the memory unit at the time of measuring theEMC of the semiconductor chip.
 4. The jig of claim 2, wherein: thememory unit includes a general database configured to store informationrequired for a general function test of the semiconductor chip; an EMCdatabase configured to make EMC information of components in the systemaccording to an operation situation of the system into a database andstore the EMC data; a data selection unit configured to provide theinformation stored in the general database or the EMC database to thechip mount unit by the control of the measurement control unit; and ameasurement database configured to store a measurement result of thechip mount unit.
 5. The jig of claim 2, further comprising: a signalinput unit configured to receive a plurality of control signals fordriving the jig; and a measurement result output unit configured tooutput the measurement result of the EMC for the semiconductor chip. 6.The jig of claim 5, wherein the plurality of control signals includes amode signal for determining whether the EMC for the semiconductor chipis measured, a clock signal for synchronizing the jig with thesemiconductor chip and a voltage signal for driving the memory unit. 7.A method for measuring EMC of a semiconductor chip, comprising: mountingthe semiconductor chip for which the EMC is to be measured on a jig;implementing predetermined operation environments of a system in whichthe semiconductor chip is used through the jig; and measuring the EMC ofthe semiconductor chip under the implemented operation environments. 8.The method of claim 7, wherein the jig stores EMC information ofcomponents in the system according to the operation situation of thesystem and implements the predetermined operation environments of thesystem by using the stored EMC information.